Freq. range：2～45GHz
Power level: 2～100W
Package type: SMT, microstrip, CCGA
Implementation: full magnetic microstrip, ceramic nesting,
MEMS
Features：tight structure, low IL, wide freq. band, high
integration Technical performance
Freq. range(GHz) | Relative bandwidth | Typical value | Peak power， DC10%(W) | Dim.(mm) | ||
VSWR | IL(dB) | Isolation(dB) | ||||
2~4 | 20% | 1.2 | 0.4 | 23 | 100 | 11*11*3.5 |
3.4~4.2 | 1.25 | 0.5 | 20 | 80 | 9*9*3.5 | |
4~8 | 10% | 1.2 | 0.4 | 23 | 80 | 8*8*3.5 |
5~6 | 1.2 | 0.5 | 20 | 10 | 6*6*3 | |
8~12 | 20% | 1.2 | 0.4 | 23 | 80 | 5*5*3 |
8~12 | 1.3 | 0.5 | 18 | 40 | 4*4.5*3 | |
12~18 | 15% | 1.2 | 0.4 | 23 | 60 | 4*4*3 |
14~18 | 1.25 | 0.5 | 20 | 40 | 4*4*3 | |
18~26.5 | 15% | 1.25 | 0.5 | 20 | 30 | 4*4*3 |
24~27.5 | 1.25 | 0.5 | 20 | 30 | 4*4*3 | |
26.5~45 | 15% | 1.3 | 0.7 | 18 | 20 | 3.5*4*3 |
27~31 | 1.3 | 0.7 | 18 | 20 | 3.5*4*3 | |